The phone that changes with your needs via Smart Outfits.
| Network | GSM / HSPA / LTE / 5G |
| Launch | 2026 May 15 |
| Body | Dimensions: 162 x 75.2 x 8.3 mm Weight: 198 g Build: Repairable Design Modular 'Smart Outfits' SIM: Dual SIM + eSIM Modular Functionality |
| Display | Type: P-OLED 120Hz PureDisplay 1200 nits Size: 6.6 inches Res: 1080 x 2400 pixels Protection: Gorilla Glass 5 |
| Platform | OS: Android 16 (Clean UI) Chipset: Snapdragon 7s Gen 4 (4 nm) CPU: Octa-core GPU: Adreno 760 |
| Memory | Card slot: microSDXC Internal: 128GB 8GB RAM 256GB 12GB RAM UFS 3.1 |
| Camera | Dual: 108 MP (wide) + 13 MP (ultrawide) Features: Smart Outfit Connectors Easy Repair Video: 4K@30fps |
| Comms/Sound | Loudspeaker: Yes stereo speakers 3.5mm jack: Yes WLAN: Wi-Fi 6E Bluetooth: 5.3 NFC: Yes |
| Battery | Type: Li-Po 5000 mAh Charging: 33W wired |
| Colors | Industrial Black Raw Copper |
HMD Fusion 5G brings modularity back to smartphones. It features a unique 6-pin connector on the back that allows you to attach 'Smart Outfits'—functional cases that add features like a Ring Light for streamers, a Gaming Controller, or a Rugged Shell with extra battery. It is designed for 'Gen 2 Repairability', allowing users to swap the screen or charging port in minutes. Powered by the reliable Snapdragon 7s Gen 4, it offers balanced performance. It is a device for makers, creators, and those who want a phone that lasts for years.
*Estimated based on current flagship market trends.